Approaches to Thermal Management in Handheld Devices: A Survey

  IJCTT-book-cover
 
International Journal of Computer Trends and Technology (IJCTT)          
 
© 2015 by IJCTT Journal
Volume-21 Number-2
Year of Publication : 2015
Authors : Arpana Bhagwat, Dr. Prasad G R
  10.14445/22312803/IJCTT-V21P111

MLA

Arpana Bhagwat, Dr. Prasad G R "Approaches to Thermal Management in Handheld Devices: A Survey". International Journal of Computer Trends and Technology (IJCTT) V21(2):56-60, March 2015. ISSN:2231-2803. www.ijcttjournal.org. Published by Seventh Sense Research Group.

Abstract -
Use of handheld devices like smart phones, tablets etc. have become a basic need for the generation. With advancements in IT technology, lots of applications are running on these devices. To support faster response, high-end processors which run on GHz clock are used in these devices. In addition, complex architectures with specialized processors are used to support video calling, streaming multimedia, gaming, multitasking etc. Because of this, high power consumption and heat generation is seen in handheld devices. With increase in temperature,users may find it inconvenient to use devices and temperature beyond certain limit may lead to breakdown of the devices. Hence there is a need to address this issue and many attempts have been made in this regard. This paper is a survey of the earlier works on thermal managementin handheld devices by passive as well as active cooling methods.

References
1. “The Effect of Thermal Capacitance and Phase Change on Outside Plant Electronic Enclosures”, RenCe C. Estes, IEEE TRANSACTIONS ON COMPONENTS, HYBRIDS, AND MANUFACTURING TECHNOLOGY, VOL. 15, NO. 5, OCTOBER 1992
2. “Transient Thermal Management of Temperature Fluctuations During Time Varying Workloads on Portable Electronics”, Mark J. Vesligaj and Cristina H. Amon, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGY, VOL. 22, NO. 4, DECEMBER 1999
3. “PERFORMANCE ANALYSIS OF AN ENHANCED PCM THERMAL CONTROL UNIT”, Esam M. Alawadhi and Cristina H. Amon, Inter Society Conference on Thermal Phenomena 2000
4. “PCM Thermal Control Unit for Portable Electronic Devices: Experimental and Numerical Studies”, Esam M. Alawadhi and Cristina H. Amon, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 26, NO. 1, MARCH 2003
5. “Thermal Management of Mobile Phone using Phase Change Material”, F.L. Tan and S.C. Fok, IEEE 9th Electronics Packaging Technology Conference 2007
6. “Thermal Performance of PCM-Cooled Mobile Phone”, F.L. Tan, S.C. Fok, W. Shen and Jony, 11th Electronics Packaging Technology Conference 2009
7. “THERMODYNAMIC MODELING AND CALORIMETRY OF NANOSTRUCTURED MATERIALS FOR CAPACITIVE THERMAL MANAGEMENT”, Oksen T. Baris, Hongxiang Tian, Sanjiv Sinha, IEEE 2010
8. “PARAMETRIC THERMAL MODELING OF HEAT TRANSFER IN HANDHELD ELECTRONIC DEVICES”, Jaeho Lee, David W. Gerlach, and Yogendra K. Joshi, IEEE 2008
9. "Experimental Investigation On Bio-Mimic Transpiration Cooling For High-End Handheld Devices", Xinsheng ZHANG, Yuanchen HU, Shuang Chui , Ming Zhou,Xuejiao HU, IEEE 2010
10. “High Power CSP Thermal ", Mingzong Wang, Eason Chen, Jeng Yuan Lai, Yu-Po Wang, IEEE 2007
11. “Improving Thermal Management of Multi-Finger InGaP Collector-Up HBTs with a Highly Compact Heat-Spreading Structure by GA”, Hsien-Cheng TSENG, Wen-Young LI, and Tze-Wei CHEN, International Microsystems, Packaging, Assembly and Circuits Technology conference
12. “COIN INSERTION TECHNOLOGY FOR PCB THERMAL SOLUTION”, Chien-Cheng Lee, Wu-Yung Chen,
13. “THERMAL TESTS AND ANALYSIS OF THIN GRAPHITE HEAT SPREADER FOR HOT SPOT REDUCTION IN HANDHELD DEVICES", Yin Xiong, Martin Smalc, Julian Norley, John Chang, Helen Mayer, Prathib Skandakumaran, Brad Reis, IEEE 2008
14. "Dynamics and Topology Optimization of Piezoelectric Fans", Philipp Bürmann, Arvind Raman, and Suresh V. Garimella, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 25, NO. 4, DECEMBER 2003
15. “A Minimum Specification of Air-cooling with Layout Design by Efficient Optimization Scheme for Outline Design Stage”, Yoshiharu Iwata, Shintaro Hyashi, Ryohei Satoh and Kozo Fujimoto, 6th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-System, EuroSimE 2005
16. "Ionic Winds for Enhanced Cooling in Portable Platforms", David B. Go, Raul A. Maturana, Rajiv K. Mongia, Suresh V. Garimella and Timothy S. Fisher, 10th Electronics Packaging Technology ConferenceIEEE 2008
17. "Acoustic emissions from active cooling solutions for portable devices", E.J. Walsh, P.A. Walsh, R. Grimes & J. Punch, IEEE 2008
18. "THE PERFORMANCE OF ACTIVE COOLING IN A MOBILE PHONE", Ed Walsh, Ronan Grimes, Pat Walsh, IEEE 2008
19. "Experimental Studies on Synthetic Jet Cooling Enhancement for Portable Platforms", David B. Go and Rajiv K. Mongia, IEEE 2008
20. "An Investigation into Momentum and Temperature Fields of a Meso-Scale Synthetic Jet", Omidreza Ghaffari, M. Baris Dogruoz and Mehmet Arik, 14th IEEE ITHERM Conference 2014
21. "A Study of Hot Spot in Silicon Device for Stacked Die Packages", Jotaro Akiyama, Masanobu Naeshiro and Masazumi Amagai, 2005 International Symposium on Electronics Materials and Packaging (EMAP2005)
22. "THERMAL MANAGEMENT OF A STACKED-DIE PACKAGE IN A HANDHELD ELECTRONIC DEVICE USING PASSIVE SOLUTIONS", Sung-won Moon, Suzana Prstic, and Chia-pin Chiu, IEEE 2006
23. "Issues and Solutions for Thermal Management in Plastic Packages", Yifan Guo and Bhuvaneshwaran Vijayakumar, 7th International Conference on Electronics Packaging Technology IEEE 2006
24. "Generic Thermal Analysis for Phone and Tablet Systems", Siva P. Gurrum, Darvin R. Edwards, Thomas Marchand-Golder, Jotaro Akiyama, Satoshi Yokoya, Jean-Francois Drouard, Franck Dahan, IEEE 2012
25. "Ambient variation-tolerant and inter components aware thermal management for mobile system on chips", Francesco Paterna, Joe Zanotelli and Tajana Simunic Rosing, EDAA 2014
26. "Hybrid Dynamic Thermal Management Based on Statistical Characteristics of Multimedia Applications", Inchoon Yeo and Eun Jung Kim, ISLPED’08, August 11–13, ACM 2008
27. "A 1.6 GHz Quad-Core Application Processor Manufactured in 32 nm High-k Metal Gate Process for Smart Mobile Devices", Se-Hyun Yang, Jungyul Pyo, Youngmin Shin, and Jae Cheol Son, TOPICS IN INTEGRATED CIRCUITS FOR COMMUNICATIONS IEEE Communications Magazine April 2013
28. "HEATSMART: An Interactive Application aware Thermal Management Framework for MPSoC Embedded Systems", Jude Angelo Ambrose, 2011 6th International Conference on Industrial and Information Systems, ICIIS 2011, Aug 2011, Sri Lanka

Keywords
Thermal Management, Heat Dissipation, Cooling